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The world's first technology patent for an integrated circuit package including a miniature fractal antenna has been granted to Fractus, the pioneering developer of fractal antenna technology. The technology, commonly referred to as Antenna in Package (AiP), has been granted in the US under patent #7095372.

Fractus technology allows the antenna, traditionally a separate component, to be integrated with other RF components such as the radio and RF processor. Using fractal geometry with its extremely economical use of space, Fractus has created a solution that is small enough to be incorporated onto the IC (Integrated Circuit) and accommodate multiple bands (frequencies) to support numerous short-range wireless standards.

"The ability to integrate the antenna into the semiconductor package will dramatically reduce product development and manufacturing costs for OEMs and ODMs worldwide" said Dr. Carles Puente, CTO and IPR director, Fractus. "Ownership of this patent highlights Fractus' pioneering role for the future of short-range wireless communications."

AiP reduces the bill of materials, component size, motherboard complexity, design cost and time to market for devices where wireless capability already exists such as mobile handsets. It also facilitates the implementation of discrete wireless functions within mobile devices such as mobile phones, digital cameras, MP3 players and other myriad devices using short-range wireless technologies. AiP technology is suitable for Bluetooth, WLAN, GPS, UWB and Zigbee.

Fractus is working with leading semiconductor manufacturers to bring AiP to market and has extensive experience developing other short-range wireless solutions with leaders such as CSR, ST Microelectronics, SiGe Semiconductors, Atheros Communications and Philips Semiconductors, says the company.

http://www.electropages.com/viewArticle.aspx?intArticle=7674 (http://www.electropages.com/viewArticle.aspx?intArticle=7674)