Breakthrough fractal antenna patent
Fractus has been granted the world's first technology patent for an IC package including a miniature fractal antenna.
The technology, commonly referred to as Antenna in Package (AiP), has been granted a patent in the US.
Fractus technology allows the antenna, traditionally a separate component, to be integrated with other RF components such as the radio and RF processor. Using fractal geometry, the company has created a design that is small enough to be incorporated onto the IC and accommodate multiple bands (frequencies) to support numerous short-range wireless standards.
According to the firm, AiP reduces the bill of materials, component size, motherboard complexity, design cost and time to market for devices where wireless capability already exists such as mobile handsets. It also facilitates the implementation of discrete wireless functions within mobile devices such as mobile phones, digital cameras, MP3 players and the like. AiP technology is suitable for Bluetooth, WLAN, GPS, UWB and ZigBee.
Fractus - www.fractus.com